%0 Conference Paper %1 conf/3dic/LiaoZL11 %A Liao, Xiongfei %A Zhou, Jun %A Liu, Xin %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-4 %T Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#LiaoZL11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/LiaoZL11, added-at = {2018-03-06T00:00:00.000+0100}, author = {Liao, Xiongfei and Zhou, Jun and Liu, Xin}, biburl = {https://www.bibsonomy.org/bibtex/2e64410229b77730ac0f14d8bdc4ae43d/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6263036}, interhash = {217cd5bddc044380de974b8403fc403d}, intrahash = {e64410229b77730ac0f14d8bdc4ae43d}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:14.000+0200}, title = {Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#LiaoZL11}, year = 2011 }