%0 Journal Article %1 journals/ieiceee/AragaNVPB18 %A Araga, Yuuki %A Nagata, Makoto %A Vos, Joeri De %A der Plas, Geert Van %A Beyne, Eric %D 2018 %J IEICE Electron. Express %K dblp %N 13 %P 20180460 %T A study on substrate noise coupling among TSVs in 3D chip stack. %U http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee15.html#AragaNVPB18 %V 15

@article{journals/ieiceee/AragaNVPB18, added-at = {2021-10-14T00:00:00.000+0200}, author = {Araga, Yuuki and Nagata, Makoto and Vos, Joeri De and der Plas, Geert Van and Beyne, Eric}, biburl = {https://www.bibsonomy.org/bibtex/293351c1fd48cbdaa58241e4eb402bf7e/dblp}, ee = {https://doi.org/10.1587/elex.15.20180460}, interhash = {2f9df8ba94e088c3843c8a68d8f0d8d8}, intrahash = {93351c1fd48cbdaa58241e4eb402bf7e}, journal = {IEICE Electron. Express}, keywords = {dblp}, number = 13, pages = 20180460, timestamp = {2024-04-09T06:46:19.000+0200}, title = {A study on substrate noise coupling among TSVs in 3D chip stack.}, url = {http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee15.html#AragaNVPB18}, volume = 15, year = 2018 }