%0 Conference Paper %1 conf/3dic/FukushimaBMLK13 %A Fukushima, Takafumi %A Bea, Jichoel %A Murugesan, Mariappan %A Lee, Kang Wook %A Koyanagi, Mitsumasa %B 3DIC %D 2013 %I IEEE %K dblp %P 1-4 %T Development of via-last 3D integration technologies using a new temporary adhesive system. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#FukushimaBMLK13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/FukushimaBMLK13, added-at = {2021-02-16T00:00:00.000+0100}, author = {Fukushima, Takafumi and Bea, Jichoel and Murugesan, Mariappan and Lee, Kang Wook and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/209b04109cc5419d3720560a3aaf4a03f/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702383}, interhash = {3f638c3e1a80f7a1cf3d1db0d6a49de2}, intrahash = {09b04109cc5419d3720560a3aaf4a03f}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:52.000+0200}, title = {Development of via-last 3D integration technologies using a new temporary adhesive system.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#FukushimaBMLK13}, year = 2013 }