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Disambiguation of "Fukushima, Takafumi"

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Development of via-last 3D integration technologies using a new temporary adhesive system.

, , , , and . 3DIC, page 1-4. IEEE, (2013)

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Yo Fukushima

 

Other publications of authors with the same name

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration., , , , , , , , , and . Micromachines, 2 (1): 49-68 (2011)Three-dimensional integration technology and integrated systems., , and . ASP-DAC, page 409-415. IEEE, (2009)Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI., , and . 3DIC, page 1-5. IEEE, (2019)Temporary bonding strength control for self-assembly-based 3D integration., , , , , , and . 3DIC, page 1-4. IEEE, (2011)A very low area ADC for 3-D stacked CMOS image processing system., , , , , , and . 3DIC, page 1-4. IEEE, (2011)Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV., , , , , , , , and . 3DIC, page 1-4. IEEE, (2013)A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor., , , , , , and . 3DIC, page 1-4. IEEE, (2013)Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory., , , , , , , and . 3DIC, page 1-4. IEEE, (2013)Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip., , , , , , , , , and . BioCAS, page 519-523. IEEE, (2022)High-bandwidth data transmission of new transceiver module through optical interconnection., , , , , and . 3DIC, page 1-4. IEEE, (2011)