%0 Journal Article %1 journals/tcad/NiXHLYW21 %A Ni, Tianming %A Xu, Qi %A Huang, Zhengfeng %A Liang, Huaguo %A Yan, Aibin %A Wen, Xiaoqing %D 2021 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 9 %P 1952-1956 %T A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC. %U http://dblp.uni-trier.de/db/journals/tcad/tcad40.html#NiXHLYW21 %V 40

@article{journals/tcad/NiXHLYW21, added-at = {2021-09-01T00:00:00.000+0200}, author = {Ni, Tianming and Xu, Qi and Huang, Zhengfeng and Liang, Huaguo and Yan, Aibin and Wen, Xiaoqing}, biburl = {https://www.bibsonomy.org/bibtex/2111b22030157de06fde56fef7a8a541f/dblp}, ee = {https://doi.org/10.1109/TCAD.2020.3025169}, interhash = {46e77e966210f75c38a9beda0c85a327}, intrahash = {111b22030157de06fde56fef7a8a541f}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, number = 9, pages = {1952-1956}, timestamp = {2024-04-08T19:47:33.000+0200}, title = {A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad40.html#NiXHLYW21}, volume = 40, year = 2021 }