Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC.

T. Ni, Q. Xu, Z. Huang, H. Liang, A. Yan, and X. Wen. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 40 (9): 1952-1956 (2021)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Huaguo Liang

Liang Liang

Liang-Liang Fu

Shu Chuan Liang

Dsin Dshin Liang

Other publications of authors with the same name

CPCA: An efficient wireless routing algorithm in WiNoC for cross path congestion awareness.Y. Ouyang, Z. Li, J. Li, C. Sun, H. Liang, and G. Du. Integr., (2019)Design of MNU-Resilient latches based on input-split C-elements.Z. Huang, X. Li, Z. Gong, H. Liang, Y. Lu, Y. Ouyang, and T. Ni. Microelectron. J., (2021)Reliability analysis and comparison of ring-PUF based on probabilistic models.J. Bian, Z. Huang, Y. Lin, Z. Yang, H. Liang, and T. Ni. Microelectron. J., (February 2024)A reconfigurable PUF structure with dual working modes based on entropy separation model.Y. Wang, H. Liang, Y. Wang, L. Yao, M. Yi, Z. Huang, and Y. Lu. Microelectron. J., (2022)Architecting a congestion pre-avoidance and load-balanced wireless network-on-chip.C. Sun, Y. Ouyang, and H. Liang. J. Parallel Distributed Comput., (2022)Dual-Interlocked-Storage-Cell-Based Double-Node-Upset Self-Recoverable Flip-Flop Design for Safety-Critical Applications.A. Yan, Z. Xu, J. Cui, Z. Ying, Z. Huang, H. Liang, P. Girard, and X. Wen. ISCAS, page 1-5. IEEE, (2020)Balancing wrapper chains of SoC core based on best interchange decreasing.M. Yi, H. Liang, and Z. Huang. SoC, page 1-4. IEEE, (2008)Design of a Highly Robust Triple-Node-Upset Self-Recoverable Latch.H. Xu, C. Sun, L. Zhou, H. Liang, and Z. Huang. IEEE Access, (2021)High-Throughput Portable True Random Number Generator Based on Jitter-Latch Structure.X. Wang, H. Liang, Y. Wang, L. Yao, Y. Guo, M. Yi, Z. Huang, H. Qi, and Y. Lu. IEEE Trans. Circuits Syst. I Regul. Pap., 68 (2): 741-750 (2021)A Self-Biased Current Reference Source-Based Pre-Bond TSV Test Solution.J. Liu, S. Cheng, T. Chen, X. Wu, and H. Liang. IEEE Trans. Very Large Scale Integr. Syst., 32 (4): 774-781 (April 2024)

BibSonomy

Disambiguation of "Liang, Huaguo"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC.

Please choose a person to relate this publication to

Huaguo Liang

Liang Liang

Liang-Liang Fu

Shu Chuan Liang

Dsin Dshin Liang

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Liang, Huaguo"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC.

Please choose a person to relate this publication to

Huaguo Liang

Liang Liang

Liang-Liang Fu

Shu Chuan Liang

Dsin Dshin Liang

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC.