Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.
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%0 Conference Paper
%1 conf/3dic/FukushimaSHNBHM15
%A Fukushima, Takafumi
%A Suzuki, Taku
%A Hashiguchi, Hideto
%A Nagai, Chisato
%A Bea, Jichoel
%A Hashimoto, Hiroyuki
%A Murugesan, Mariappan
%A Lee, Kang Wook
%A Tanaka, Tetsu
%A Asami, Kazushi
%A Kitamura, Yasuhiro
%A Koyanagi, Mitsumasa
%B 3DIC
%D 2015
%I IEEE
%K dblp
%P TS7.4.1-TS7.4.4
%T Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#FukushimaSHNBHM15
%@ 978-1-4673-9385-0
@inproceedings{conf/3dic/FukushimaSHNBHM15,
added-at = {2021-02-16T00:00:00.000+0100},
author = {Fukushima, Takafumi and Suzuki, Taku and Hashiguchi, Hideto and Nagai, Chisato and Bea, Jichoel and Hashimoto, Hiroyuki and Murugesan, Mariappan and Lee, Kang Wook and Tanaka, Tetsu and Asami, Kazushi and Kitamura, Yasuhiro and Koyanagi, Mitsumasa},
biburl = {https://www.bibsonomy.org/bibtex/2a6553c09f9b526565bc5082ba63661ed/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2015},
ee = {https://doi.org/10.1109/3DIC.2015.7334578},
interhash = {943b177ea01a44265d30282a61e3e97b},
intrahash = {a6553c09f9b526565bc5082ba63661ed},
isbn = {978-1-4673-9385-0},
keywords = {dblp},
pages = {TS7.4.1-TS7.4.4},
publisher = {IEEE},
timestamp = {2024-04-10T12:10:59.000+0200},
title = {Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#FukushimaSHNBHM15},
year = 2015
}
