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%0 Conference Paper
%1 conf/3dic/KinoHTSIFKT15
%A Kino, Hisashi
%A Hashiguchi, Hideto
%A Tanikawa, Seiya
%A Sugawara, Yohei
%A Ikegaya, Shunsuke
%A Fukushima, Takafumi
%A Koyanagi, Mitsumasa
%A Tanaka, Tetsu
%B 3DIC
%D 2015
%I IEEE
%K dblp
%P TS8.26.1-TS8.26.4
%T Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KinoHTSIFKT15
%@ 978-1-4673-9385-0
@inproceedings{conf/3dic/KinoHTSIFKT15,
added-at = {2021-10-14T00:00:00.000+0200},
author = {Kino, Hisashi and Hashiguchi, Hideto and Tanikawa, Seiya and Sugawara, Yohei and Ikegaya, Shunsuke and Fukushima, Takafumi and Koyanagi, Mitsumasa and Tanaka, Tetsu},
biburl = {https://www.bibsonomy.org/bibtex/2017d046f1dc8dea15230968e15ab54b2/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2015},
ee = {https://doi.org/10.1109/3DIC.2015.7334596},
interhash = {fccbd4abba1677b8ea1212de592a65f6},
intrahash = {017d046f1dc8dea15230968e15ab54b2},
isbn = {978-1-4673-9385-0},
keywords = {dblp},
pages = {TS8.26.1-TS8.26.4},
publisher = {IEEE},
timestamp = {2024-04-10T12:10:59.000+0200},
title = {Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KinoHTSIFKT15},
year = 2015
}