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Analysis and resolution of a thermally accelerated early life failure mechanism in a 40 V GaN FET.

, , and . Microelectron. Reliab., 54 (12): 2675-2681 (2014)

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High Temperature and High Humidity Reliability Evaluation of Large-Area 1200V and 1700V SiC Diodes., , , , , , , , , and 1 other author(s). IRPS, page 1-4. IEEE, (2023)Analysis and resolution of a thermally accelerated early life failure mechanism in a 40 V GaN FET., , and . Microelectron. Reliab., 54 (12): 2675-2681 (2014)Reliability comparison of 28V-50V GaN-on-SiC S-band and X-band technologies., , , , , , and . Microelectron. Reliab., (2018)A High Efficiency, Ka-Band, GaN-on-SiC MMIC with Low Compression., , , , , , , , , and 4 other author(s). BCICTS, page 1-4. IEEE, (2019)Reliability studies of SiC vertical power MOSFETs., , , , , , , , , and . IRPS, page 2. IEEE, (2018)Negative Gate Bias TDDB evaluation of n-Channel SiC Vertical Power MOSFETs., , , , , , , , , and . IRPS, page 8. IEEE, (2022)DC and RF Reliability Assessment of 5G-MMW capable GaN HEMT Process (Invited)., , , , , , , , , and 2 other author(s). IRPS, page 11. IEEE, (2022)GaN HEMTs Design and Modeling for 5G., , , , , , , , and . IRPS, page 1-4. IEEE, (2023)