( en | de | ru )

 

Disambiguation

From post

копироватьудалитьдобавить публикацию в буфер
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion.

, , , , , , , , и . Microelectron. Reliab., (2016)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

No persons found for author name Usui, Masanori
add a person with the name Usui, Masanori
 

Другие публикации лиц с тем же именем

Effects of uni-axial mechanical stress on IGBT characteristics., , , , и . Microelectron. Reliab., 45 (9-11): 1682-1687 (2005)Young's modulus of a sintered Cu joint and its influence on thermal stress., , , , , и . Microelectron. Reliab., (2017)Thermal cycle reliability of Cu-nanoparticle joint., , и . Microelectron. Reliab., 55 (9-10): 1861-1866 (2015)Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding., , , , , , и . Microelectron. Reliab., (2017)Warpage analysis of layered structures connected by direct brazing., , , , и . Microelectron. Reliab., 51 (9-11): 1836-1839 (2011)Design concept for wire-bonding reliability improvement by optimizing position in power devices., , , и . Microelectron. J., 37 (3): 262-268 (2006)Thermal simulation of joints with high thermal conductivities for power electronic devices., , , , , , и . Microelectron. Reliab., 55 (7): 1060-1066 (2015)Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography., , , , , и . Microelectron. Reliab., (2016)Characterization of Trench MOS Gate Structures Utilizing Photon Emission Microscopy., , , , , и . Microelectron. Reliab., 42 (9-11): 1647-1652 (2002)Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion., , , , , , , , и . Microelectron. Reliab., (2016)