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Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding., , , , , , and . Microelectron. Reliab., (2017)Effects of uni-axial mechanical stress on IGBT characteristics., , , , and . Microelectron. Reliab., 45 (9-11): 1682-1687 (2005)Young's modulus of a sintered Cu joint and its influence on thermal stress., , , , , and . Microelectron. Reliab., (2017)Thermal cycle reliability of Cu-nanoparticle joint., , and . Microelectron. Reliab., 55 (9-10): 1861-1866 (2015)Warpage analysis of layered structures connected by direct brazing., , , , and . Microelectron. Reliab., 51 (9-11): 1836-1839 (2011)Design concept for wire-bonding reliability improvement by optimizing position in power devices., , , and . Microelectron. J., 37 (3): 262-268 (2006)Thermal simulation of joints with high thermal conductivities for power electronic devices., , , , , , and . Microelectron. Reliab., 55 (7): 1060-1066 (2015)Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography., , , , , and . Microelectron. Reliab., (2016)Characterization of Trench MOS Gate Structures Utilizing Photon Emission Microscopy., , , , , and . Microelectron. Reliab., 42 (9-11): 1647-1652 (2002)Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion., , , , , , , , and . Microelectron. Reliab., (2016)