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A full-scale solution to the rectilinear obstacle-avoiding Steiner problem.

, , , , , and . Integr., 41 (3): 413-425 (2008)

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lambda-OAT: lambda-Geometry Obstacle-Avoiding Tree Construction With O(nlog n) Complexity., , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 26 (11): 2073-2079 (2007)Substrate Topological Routing for High-Density Packages., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 28 (2): 207-216 (2009)Effective congestion reduction for IC package substrate routing., , , , , and . ACM Trans. Design Autom. Electr. Syst., 15 (3): 27:1-27:21 (2010)Topological routing to maximize routability for package substrate., , , , , , and . DAC, page 566-569. ACM, (2008)A full-scale solution to the rectilinear obstacle-avoiding Steiner problem., , , , , and . Integr., 41 (3): 413-425 (2008)Dual-Vdd Buffer Insertion for Power Reduction., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 27 (8): 1498-1502 (2008)Diffusion-driven congestion reduction for substrate topological routing., , , , , and . ISPD, page 175-180. ACM, (2009)