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Edge Intelligence-Based Ultra-Reliable and Low-Latency Communications for Digital Twin-Enabled Metaverse.

, , , , and . IEEE Wirel. Commun. Lett., 11 (8): 1733-1737 (2022)

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Development and Deployment of an IoT-Based Reconfigurable System: A Case Study for Smart Garden., , , and . INISCOM, volume 257 of Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, page 243-252. Springer, (2018)Real-Time Optimized Path Planning and Energy Consumption for Data Collection in Unmanned Ariel Vehicles-Aided Intelligent Wireless Sensing., , , , , and . IEEE Trans. Ind. Informatics, 18 (4): 2753-2761 (2022)Distributed Communication and Computation Resource Management for Digital Twin-Aided Edge Computing With Short-Packet Communications., , , , and . IEEE J. Sel. Areas Commun., 41 (10): 3008-3021 (October 2023)Digital Twin-Aided Intelligent Offloading With Edge Selection in Mobile Edge Computing., , , , and . IEEE Wirel. Commun. Lett., 11 (4): 806-810 (2022)UiTiOt-Vlab: A Low Cost Physical IoTs Testbed Based on Over-The-Air Programming Approach., , and . INISCOM, volume 293 of Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, page 181-192. Springer, (2019)Fairness-aware Latency Minimisation in Digital Twin-aided Edge Computing with Ultra-Reliable and Low-Latency Communications: A Distributed Optimisation Approach (Invited Paper)., , , and . IEEECONF, page 1045-1049. IEEE, (2022)Optimal Resource Allocation for 6G UAV-enabled Mobile Edge Computing with Mission-Critical Applications., , , , and . MetaCom, page 720-723. IEEE, (2023)UiTiOt v3: A Hybrid Testbed for Evaluation of Large-Scale IoT Networks., , , and . SoICT, page 155-162. ACM, (2018)Quantum-Inspired Real-Time Optimization for 6G Networks: Opportunities, Challenges, and the Road Ahead., , , , , and . IEEE Open J. Commun. Soc., (2022)From Digital Twin to Metaverse: The Role of 6G Ultra-Reliable and Low-Latency Communications with Multi-Tier Computing., , , , , and . IEEE Wirel. Commun., 30 (3): 140-146 (June 2023)