Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Out of plane vs in plane flexural behaviour of thin polysilicon films: Mechanical characterization and application of the Weibull approach., , , and . Microelectron. Reliab., 45 (9-11): 1758-1763 (2005)MEMS-based surface mounted health monitoring system for composite laminates., , , , , and . Microelectron. J., 44 (7): 598-605 (2013)The effect of nano-scale interaction forces on the premature pull-in of real-life Micro-Electro-Mechanical Systems., , , , and . Microelectron. Reliab., 52 (1): 271-281 (2012)A domain decomposition method for the simulation of fracture in polysilicon MEMS., , , and . Microelectron. Reliab., 53 (8): 1045-1054 (2013)Piezoelectric Mems for Microparticles Detection., , , and . IEEE SENSORS, page 1-4. IEEE, (2021)Two-Scale Simulation of Drop-Induced Failure of Polysilicon MEMS Sensors., , , , and . Sensors, 11 (5): 4972-4989 (2011)Geometry optimization of a Lorentz force, resonating MEMS magnetometer., , , , and . Microelectron. Reliab., 54 (6-7): 1192-1199 (2014)A Metaplate in MEMS for innovative applications: vibration isolation and tunable mechanical filters., , , and . IEEE SENSORS, page 1-4. IEEE, (2020)Coupled domain decomposition-proper orthogonal decomposition methods for the simulation of quasi-brittle fracture processes., , , and . Adv. Model. Simul. Eng. Sci., 3 (1): 28:1-28:24 (2016)A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging., , , , and . Microelectron. Reliab., 54 (9-10): 2039-2043 (2014)