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Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive.

, , , and . Microelectron. Reliab., 55 (8): 1241-1247 (2015)

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Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive., , , and . Microelectron. Reliab., 55 (8): 1241-1247 (2015)A patient-to-CT registration method based on spherical unwrapping and H-K curvature descriptors for surgical navigation system., , and . MFI, page 1-6. IEEE, (2017)Multiple RGB-D Camera-based User Intent Position and Object Estimation., , and . AIM, page 176-180. IEEE, (2018)Robot's individual emotion generation model and action coloring according to the robot's personality., , , and . RO-MAN, page 257-262. IEEE, (2009)Deep learning based 3D defect detection system using photometric stereo illumination., , and . ICAIIC, page 484-487. IEEE, (2019)Emotion Interaction System for a Service Robot., , , , , , , , , and 7 other author(s). RO-MAN, page 351-356. IEEE, (2007)Real-Time Weld Quality Prediction Using a Laser Vision Sensor in a Lap Fillet Joint during Gas Metal Arc Welding., , , , , and . Sensors, 20 (6): 1625 (2020)Correlation between Geometrically Induced Oxygen Octahedral Tilts and Multiferroic Behaviors in BiFeO3 Films, , , , , , , , , and 1 other author(s). Advanced Functional Materials, 28 (19): 1800839 (2018)Background Registration-Based Adaptive Noise Filtering of LWIR/MWIR Imaging Sensors for UAV Applications., , and . Sensors, 18 (1): 60 (2018)Accuracy Evaluation of Robotic Tonometry Pulse Sensor System Based on Radial Artery Pulse Wave Simulator., and . IEEE Trans. Instrum. Meas., 69 (10): 7646-7657 (2020)