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Distributed task migration for thermal hot spot reduction in many-core microprocessors.

, , , , and . ASICON, page 1-4. IEEE, (2013)

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Dynamic thermal management for multi-core microprocessors considering transient thermal effects., , , and . ASP-DAC, page 473-478. IEEE, (2013)Compact lateral thermal resistance modeling and characterization for TSV and TSV array., , and . ICCAD, page 275-280. IEEE, (2013)Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 33 (10): 1490-1502 (2014)Compact thermal modeling for package design with practical power maps., , , , and . IGCC, page 1-5. IEEE Computer Society, (2011)Parallel Thermal Analysis of 3-D Integrated Circuits With Liquid Cooling on CPU-GPU Platforms., , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 23 (3): 575-579 (2015)Task Migrations for Distributed Thermal Management Considering Transient Effects., , , and . IEEE Trans. Very Large Scale Integr. Syst., 23 (2): 397-401 (2015)Distributed task migration for thermal hot spot reduction in many-core microprocessors., , , , and . ASICON, page 1-4. IEEE, (2013)Battery state of charge estimation using adaptive subspace identification method., , , , , and . ASICON, page 91-94. IEEE, (2011)Compact nonlinear thermal modeling of packaged integrated systems., , , , and . ASP-DAC, page 157-162. IEEE, (2013)NMRPy: a novel NMR scripting system to implement artificial intelligence and advanced applications., , and . CoRR, (2021)