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Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias., , , , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 6 (3): 373-384 (2016)Transkribus entziffert Uromas Handschrift. (May 2018)Analysis of residual stresses and wear mechanism of HF-CVD diamond coated cemented carbide tools., , , , , , , and . Prod. Eng., 9 (1): 99-107 (2015)Hybrid III-V laser integration on a monolithic silicon photonic platform., , , , , , , , , and 39 other author(s). OFC, page 1-3. IEEE, (2021)A CMOS Compatible Monolithic Fiber Attach Solution with Reliable Performance and Self-Alignment., , , , , , , , , and 16 other author(s). OFC, page 1-3. IEEE, (2020)3-Stage Miller Cross-Coupled Load based Photodiode Readout for Glucose Monitoring., , and . EMBC, page 3918-3921. IEEE, (2018)Baustein auf Baustein: Eine Website mit Textpattern betreiben. c't, (2014)Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability., , , , , , , , , and 7 other author(s). IRPS, page 4. IEEE, (2015)Towards Lightweight and Robust Machine Learning for CDN Caching.. HotNets, page 134-140. ACM, (2018)CompuCache: Remote Computable Caching using Spot VMs., , , , , and . CIDR, www.cidrdb.org, (2022)