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Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.

P. Vanna-Iampikul, C. Shao, Y. Lu, S. Pentapati, Y. Heo, J. Choi, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (7): 2331-2335 (July 2023)

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Yi Lu

Yi-Chen Chen

Yi Chen

Lu Chen

Other publications of authors with the same name

Multimodal Fuzzy Fusion for Enhancing the Motor-Imagery-Based Brain Computer Interface.L. Ko, Y. Lu, H. Bustince, Y. Chang, Y. Chang, J. Fernández, Y. Wang, J. Sanz, G. Dimuro, and C. Lin. IEEE Comput. Intell. Mag., 14 (1): 96-106 (2019)A Framework Design for On-line Human Library.T. Sung, T. Wu, and Y. Lu. SETE@ICWL, volume 10676 of Lecture Notes in Computer Science, page 349-354. Springer, (2017)Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.P. Vanna-Iampikul, C. Shao, Y. Lu, S. Pentapati, Y. Heo, J. Choi, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (7): 2331-2335 (July 2023)FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning.H. Hsiao, Y. Lu, P. Vanna-Iampikul, and S. Lim. ISPD, page 93-101. ACM, (2024)On Advancing Physical Design Using Graph Neural Networks.Y. Lu, and S. Lim. ICCAD, page 2:1-2:7. ACM, (2022)3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal Tradeoffs.L. Zhu, N. Bethur, Y. Lu, Y. Cho, Y. Im, and S. Lim. ISLPED, page 19:1-19:6. ACM, (2022)An energy-efficient multicast protocol for ZigBee-based networks.S. Hu, C. Tsai, Y. Lu, M. Pan, and Y. Tseng. WCNC, page 1-6. IEEE, (2016)Single channel wireless EEG device for real-time fatigue level detection.L. Ko, W. Lai, W. Liang, C. Chuang, S. Lu, Y. Lu, T. Hsiung, H. Wu, and C. Lin. IJCNN, page 1-5. IEEE, (2015)Edge-based wireless imaging system for continuous monitoring of insect pests in a remote outdoor mango orchard.D. Rustia, W. Lee, C. Lu, Y. Wu, P. Shih, S. Chen, J. Chung, and T. Lin. Comput. Electron. Agric., (August 2023)A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs.Y. Lu, S. Pentapati, L. Zhu, G. Murali, K. Samadi, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 41 (11): 4575-4586 (2022)

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Disambiguation of "Lu, Yi-Chen"

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Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.

Please choose a person to relate this publication to

Yi Lu

Yi-Chen Chen

Yi Chen

Yi Chen

Lu Chen

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lu, Yi-Chen"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.

Please choose a person to relate this publication to

Yi Lu

Yi-Chen Chen

Yi Chen

Yi Chen

Lu Chen

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.