( en | de | ru )

 

Disambiguation of "Markovic, Tijana"

Author of the publication

copydeleteadd this publication to your clipboard
MIDAS: A Modular Ice Cream Factory Dataset on Anomalies in Sensors.

, , , and . (December 2022)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Tijana Kostic

Tijana Ristic

Tijana ivkovi

Tijana Janjusevic

Maja Markovic

 

Other publications of authors with the same name

Multi-Objective Optimization on Autoencoder for Feature Encoding and Attack Detection on Network Data., , and . GECCO Companion, page 379-382. ACM, (2023)Comparative Evaluation of Machine Learning Algorithms for Network Intrusion Detection and Attack Classification., , and . IJCNN, page 1-8. IEEE, (2022)Time-series Anomaly Detection and Classification with Long Short-Term Memory Network on Industrial Manufacturing Systems., , , , and . FedCSIS, volume 35 of Annals of Computer Science and Information Systems, page 171-181. (2023)Feature encoding with autoencoder and differential evolution for network intrusion detection using machine learning., , and . GECCO Companion, page 2152-2159. ACM, (2022)Simulation Environment for Modular Automation Systems., , , , , and . IECON, page 1-6. IEEE, (2022)Federated Learning for Network Anomaly Detection in a Distributed Industrial Environment., , , , and . ICMLA, page 218-225. IEEE, (2023)Enhanced Simulation Environment to Support Research in Modular Manufacturing Systems., , and . IECON, page 1-6. IEEE, (2023)MIDAS: A Modular Ice Cream Factory Dataset on Anomalies in Sensors., , , and . (December 2022)A Modular Ice Cream Factory Dataset on Anomalies in Sensors to Support Machine Learning Research in Manufacturing Systems., , , and . IEEE Access, (2023)Software package for regression algorithms based on Gaussian Conditional Random Fields., , , and . ICMLA, page 1121-1128. IEEE, (2022)