Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Finite difference method for electromigration analysis of multi-branch interconnects.

C. Cook, Z. Sun, T. Kim, and S. Tan. SMACD, page 1-4. IEEE, (2016)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Dagmar Chase

Stephen Cook

Katharina Chase

Peter Chaselon

Paul Wilder Chase

Other publications of authors with the same name

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires.Z. Sun, E. Demircan, M. Shroff, C. Cook, and S. Tan. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (12): 3137-3150 (2018)Invited - Cross-layer modeling and optimization for electromigration induced reliability.T. Kim, Z. Sun, C. Cook, H. Zhao, R. Li, D. Wong, and S. Tan. DAC, page 30:1-30:6. ACM, (2016)Finite difference method for electromigration analysis of multi-branch interconnects.C. Cook, Z. Sun, T. Kim, and S. Tan. SMACD, page 1-4. IEEE, (2016)Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method.C. Cook, Z. Sun, E. Demircan, M. Shroff, and S. Tan. IEEE Trans. Very Large Scale Integr. Syst., 26 (5): 969-980 (2018)Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution.X. Wang, S. Ma, S. Tan, C. Cook, L. Chen, J. Yang, and W. Yu. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 40 (3): 507-520 (2021)Reliability based hardware Trojan design using physics-based electromigration models.C. Cook, S. Sadiqbatcha, Z. Sun, and S. Tan. Integr., (2019)Dynamic reliability management for near-threshold dark silicon processors.T. Kim, Z. Sun, C. Cook, J. Gaddipati, H. Wang, H. Chen, and S. Tan. ICCAD, page 70. ACM, (2016)Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires.S. Sadiqbatcha, C. Cook, Z. Sun, and S. Tan. SMACD, page 21-24. IEEE, (2018)GPU-based Ising computing for solving max-cut combinatorial optimization problems.C. Cook, H. Zhao, T. Sato, M. Hiromoto, and S. Tan. Integr., (2019)GPU-based Ising Computing for Solving Balanced Min-Cut Graph Partitioning Problem.C. Cook, W. Jin, and S. Tan. CoRR, (2019)

BibSonomy

Disambiguation of "Cook, Chase"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Finite difference method for electromigration analysis of multi-branch interconnects.

Please choose a person to relate this publication to

Dagmar Chase

Stephen Cook

Katharina Chase

Peter Chaselon

Paul Wilder Chase

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Cook, Chase"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Finite difference method for electromigration analysis of multi-branch interconnects.

Please choose a person to relate this publication to

Dagmar Chase

Stephen Cook

Katharina Chase

Peter Chaselon

Paul Wilder Chase

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Finite difference method for electromigration analysis of multi-branch interconnects.