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A new calibration method for MEMS accelerometers with genetic algorithm.

, , , and . RCAR, page 240-245. IEEE, (2017)

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A new calibration method for MEMS accelerometers with genetic algorithm., , , and . RCAR, page 240-245. IEEE, (2017)Development of TSV simulator: FASTsv., , , , , and . NEMS, page 217-220. IEEE, (2011)In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging., , , , , and . NEMS, page 233-236. IEEE, (2013)A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge., , , , , and . NEMS, page 399-403. IEEE, (2010)Face Liveness Detection Competition (LivDet-Face) - 2021., , , , , , , , , and 22 other author(s). IJCB, page 1-10. IEEE, (2021)Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging., , , , and . NEMS, page 384-387. IEEE, (2016)New DfT architectures for 3D-SICs with a wireless test port., , , , and . ASICON, page 1-4. IEEE, (2013)A new fast adopted image matching approach with arbitrary rotation., , , , , and . APSIPA, page 1-4. IEEE, (2013)Anemometer for detection of very low speed air flow with three-dimensional directionality., , , , and . NEMS, page 615-618. IEEE, (2017)Fabrication and characterization of ultra-thin PIN detector., , , , , and . NEMS, page 513-517. IEEE, (2010)