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Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link.

, , , , , , , and . IEICE Trans. Electron., 90-C (4): 829-835 (2007)

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Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card., , , , , , and . IEEE J. Solid State Circuits, 47 (10): 2484-2495 (2012)A 12-Gb/s Non-Contact Interface With Coupled Transmission Lines., , , , , and . IEEE J. Solid State Circuits, 48 (3): 790-800 (2013)A 12.5Gb/s/link non-contact multi drop bus system with impedance-matched transmission line couplers and Dicode partial-response channel transceivers., , , , , and . CICC, page 1-4. IEEE, (2012)An 11Gb/s Inductive-Coupling Link with Burst Transmission., , , , , and . ISSCC, page 298-299. IEEE, (2008)6W/25mm2 inductive power transfer for non-contact wafer-level testing., , , , , , and . ISSCC, page 230-232. IEEE, (2011)A 12Gb/s non-contact interface with coupled transmission lines., , , , , and . ISSCC, page 492-494. IEEE, (2011)A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line., , , , , , and . ISSCC, page 52-54. IEEE, (2012)Rotary coding for power reduction and S/N improvement in inductive-coupling data communication., , , and . A-SSCC, page 205-208. IEEE, (2011)A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface., , , , , , , , , and 1 other author(s). IEEE Micro, 33 (6): 6-15 (2013)Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices., , , , , , , , and . IEEE J. Solid State Circuits, 55 (10): 2747-2755 (2020)