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Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions., , , , , , , , , и 8 other автор(ы). CICC, стр. 1-4. IEEE, (2010)Design issues and considerations for low-cost 3D TSV IC technology., , , , , , , , , и 24 other автор(ы). ISSCC, стр. 148-149. IEEE, (2010)High resolution flash time-to-digital converter with sub-picosecond measurement capabilities., , , и . SoC, стр. 1-4. IEEE, (2008)In-tier diagnosis of power domains in 3D TSV ICs., , , , , , , , , и 1 other автор(ы). 3DIC, стр. 1-6. IEEE, (2011)NoC Communication Strategies Using Time-to-Digital Conversion., , , , и . NOCS, стр. 65-74. IEEE Computer Society, (2007)3D integration: Circuit design, test, and reliability challenges., , , , , , , , и . IOLTS, стр. 217. IEEE Computer Society, (2010)FPGA Implementation of an Asynchronous Processor with Both Online and Offline Testing Capabilities., , , и . ASYNC, стр. 128-137. IEEE Computer Society, (2008)A High Resolution Flash Time-to-Digital Converter Taking Into Account Process Variability., , , и . ASYNC, стр. 163-174. IEEE Computer Society, (2007)