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A 28nm 142mW Motion-Control SoC for Autonomous Mobile Robots., , , , , , , и . ISSCC, стр. 46-47. IEEE, (2023)An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer., , , , , , , , , и 7 other автор(ы). ISCAS, стр. 1-4. IEEE, (2017)High-Efficiency Step-Down Multi-Mode Switching DC-DC Converter for IoT Devices., , , и . SoCC, стр. 449-454. IEEE, (2019)21.1 A Fully Integrated Genetic Variant Discovery SoC for Next-Generation Sequencing., , , , , , , , , и 3 other автор(ы). ISSCC, стр. 322-324. IEEE, (2020)A novel design methodology for hybrid process 3D-IC., , , , , и . VLSI-DAT, стр. 1-4. IEEE, (2012)Multi-Project System-on-Chip (MP-SoC): A Novel Test Vehicle for SoC Silicon Prototyping., , , , , , , , , и 1 other автор(ы). SoCC, стр. 137-140. IEEE, (2006)A 28nm 11.2TOPS/W Hardware-Utilization-Aware Neural-Network Accelerator with Dynamic Dataflow., , , , , , , и . ISSCC, стр. 332-333. IEEE, (2023)A Fully Integrated End-to-End Genome Analysis Accelerator for Next-Generation Sequencing., , , , , , , , , и 1 other автор(ы). ISSCC, стр. 44-45. IEEE, (2023)A novel methodology for Multi-Project System-on-a-Chip., , , , , , и . SoCC, стр. 308-311. IEEE, (2011)Universal CMOS Diamond-Graph Circuit for Embedded Computing., , , и . SoCC, стр. 206-212. IEEE, (2018)