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Impact of oxide liner properties on TSV Cu pumping and TSV stress.

J. Messemaeker, O. Pedreira, A. Moussa, N. Nabiollahi, K. Vanstreels, S. Huylenbroeck, H. Philipsen, P. Verdonck, B. Vandevelde, I. Wolf, E. Beyne, and K. Croes. IRPS, page 4. IEEE, (2015)

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Ingrid Wolf

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MEMS reliability.I. Wolf. Microelectron. Reliab., 43 (7): 1047-1048 (2003)Editorial.G. Groeseneken, I. Wolf, A. Mouthaan, and J. Bisschop. Microelectron. Reliab., 48 (8-9): 1111 (2008)Wafer-Level Aging of InGaAs/GaAs Nano-Ridge p-i-n Diodes Monolithically Integrated on Silicon.P. Hsieh, A. Tsiara, B. O'Sullivan, D. Yudistira, M. Baryshnikova, G. Groeseneken, B. Kunert, M. Pantouvaki, J. Campenhout, and I. Wolf. IRPS, page 9. IEEE, (2022)Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis.A. Khaled, S. Brand, M. Kögel, T. Appenroth, and I. Wolf. Microelectron. Reliab., (2016)Impact of Mechanical Stress on the Electrical Performance of 3D NAND.A. Kruv, A. Arreghini, M. Gonzalez, D. Verreck, G. den Bosch, I. Wolf, and A. Furnémont. IRPS, page 1-5. IEEE, (2019)Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.Y. Ding, O. Pedreira, M. Lofrano, H. Zahedmanesh, T. Chavez, H. Farr, I. Wolf, and K. Croes. IRPS, page 1-7. IEEE, (2023)Light-Assisted Investigation of the Role of Oxygen Flow during IGZO Deposition on Deep Subgap States and their Evolution Under PBTI.P. Rinaudo, A. Chasin, Y. Zhao, B. Kaczer, N. Rassoul, H. Dekkers, M. van Setten, A. Belmonte, I. Wolf, G. Kar and 1 other author(s). IRPS, page 1-6. IEEE, (2024)Investigation of stress in shallow trench isolation using UV micro-Raman spectroscopy.K. Dombrowski, B. Dietrich, I. Wolf, R. Rooyackers, and G. Badenes. Microelectron. Reliab., 41 (4): 511-515 (2001)LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration.D. Kocaay, P. Roussel, K. Croes, I. Ciofi, Y. Saad, and I. Wolf. Microelectron. Reliab., (2017)Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.Y. Yang, R. Labie, F. Ling, C. Zhao, A. Radisic, J. Olmen, Y. Travaly, B. Verlinden, and I. Wolf. Microelectron. Reliab., 50 (9-11): 1636-1640 (2010)

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Disambiguation of "Wolf, Ingrid De"

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Impact of oxide liner properties on TSV Cu pumping and TSV stress.

Please choose a person to relate this publication to

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Wolf, Ingrid De"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Impact of oxide liner properties on TSV Cu pumping and TSV stress.

Please choose a person to relate this publication to

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Other publications of authors with the same name

Disambiguation

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URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Impact of oxide liner properties on TSV Cu pumping and TSV stress.