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A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology., , , , , и . IEEE J. Solid State Circuits, 54 (11): 3203-3214 (2019)Low-power 850 nm optoelectronic integrated circuit receiver fabricated in 65 nm complementary metal-oxide semiconductor technology., , , , и . IET Circuits Devices Syst., 9 (3): 221-226 (2015)Automatic as-built modeling for concurrent progress tracking of plant construction based on laser scanning., , , , , и . Concurr. Eng. Res. Appl., 24 (4): 369-380 (2016)Doping-Optimized Back-illuminated Single-Photon Avalanche Diode in Stacked 40 nm CIS Technology Achieving 60% PDP at 905 nm., , , , , , , , , и . VLSI Technology and Circuits, стр. 1-2. IEEE, (2023)A Befitting Image Data Crawling and Annotating System with CNN Based Transfer Learning., , и . BigComp, стр. 165-168. IEEE, (2020)An 8.5ps Resolution, $2000\mum^2$ Phase-Domain Delta-Sigma TDC for Lidar Applications., , , и . A-SSCC, стр. 1-3. IEEE, (2023)A 256×256 45/65nm 3D-stacked SPAD-based direct TOF image sensor for LiDAR applications with optical polar modulation for up to 18.6dB interference suppression., , , , , и . ISSCC, стр. 96-98. IEEE, (2018)A 400 × 200 600fps 117.7dB-DR SPAD X-Ray Detector with Seamless Global Shutter and Time-Encoded Extrapolation Counter., , , , , , , и . ISSCC, стр. 100-101. IEEE, (2023)Binary artificial algae algorithm for multidimensional knapsack problems., , , , , , и . Appl. Soft Comput., (2016)Corroded pipeline failure analysis using artificial neural network scheme., , , и . Adv. Eng. Softw., (2017)