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Effects of Far-BEOL anneal on the WLR and product reliability characterization of FinFET process technology.

, , , , , , , , , , и . IRPS, стр. 6. IEEE, (2018)

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Dong-Shin Shin

Jeonghun Shin

Kirche als Weltforum: zum Dialogverständnis in kirchlichen Dokumenten seit dem Zweiten Vatikanischen Konzil. Uni München, (2009)

Hwa-Ja Shin

Jung-Hyu Shin

Hyeseon Shin

 

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Localized Layout Effect Related Reliability Approach in 8nm FinFETs Technology: From Transistor to Circuit., , , , , и . IRPS, стр. 1-5. IEEE, (2019)Effects of Far-BEOL anneal on the WLR and product reliability characterization of FinFET process technology., , , , , , , , , и 1 other автор(ы). IRPS, стр. 6. IEEE, (2018)A systematic study of gate dielectric TDDB in FinFET technology., , , , , , , , и . IRPS, стр. 4. IEEE, (2018)Effects of front-end-of line process variations and defects on retention failure of flash memory: Charge loss/gain mechanism., , , , , , , , , и 1 other автор(ы). IRPS, стр. 2. IEEE, (2015)End-to-End QoS Monitoring Tool Development and Performance Analysis for NGN., , , , и . APNOMS, том 4238 из Lecture Notes in Computer Science, стр. 332-341. Springer, (2006)Scalable and Reliable Overlay Multicast Network for Live Media Streaming., , , , и . PCM (2), том 3768 из Lecture Notes in Computer Science, стр. 48-58. Springer, (2005)Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI., , , , , , , , , и 10 other автор(ы). IRPS, стр. 3. IEEE, (2018)Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR)., , , , , , , , , и 1 other автор(ы). IRPS, стр. 3. IEEE, (2018)