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Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip.

, , , , , , and . BioCAS, page 1-4. IEEE, (2017)

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A parallel ADC for high-speed CMOS image processing system with 3D structure., , , , , , and . 3DIC, page 1-4. IEEE, (2009)A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor., , , , , , and . 3DIC, page 1-4. IEEE, (2013)A very low area ADC for 3-D stacked CMOS image processing system., , , , , , and . 3DIC, page 1-4. IEEE, (2011)Heterogeneous integration technology for MEMS-LSI multi-chip module., , , , , , , and . 3DIC, page 1-6. IEEE, (2009)A block-parallel signal processing system for CMOS image sensor with three-dimensional structure., , , , , , and . 3DIC, page 1-4. IEEE, (2010)A 37 × 37 pixels artificial retina chip with edge enhancement function for 3-D stacked fully implantable retinal prosthesis., , and . BioCAS, page 212-215. IEEE, (2012)Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip., , , , , , and . BioCAS, page 1-4. IEEE, (2017)3D integration technology for 3D stacked retinal chip., , , , , , and . 3DIC, page 1-4. IEEE, (2009)