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Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.

L. Kljucar, M. Gonzalez, I. Wolf, K. Croes, J. Bömmels, and Z. Tökei. Microelectron. Reliab., (2016)

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Ingrid Wolf

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Editorial.G. Groeseneken, I. Wolf, A. Mouthaan, and J. Bisschop. Microelectron. Reliab., 48 (8-9): 1111 (2008)MEMS reliability.I. Wolf. Microelectron. Reliab., 43 (7): 1047-1048 (2003)Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis.A. Khaled, S. Brand, M. Kögel, T. Appenroth, and I. Wolf. Microelectron. Reliab., (2016)Wafer-Level Aging of InGaAs/GaAs Nano-Ridge p-i-n Diodes Monolithically Integrated on Silicon.P. Hsieh, A. Tsiara, B. O'Sullivan, D. Yudistira, M. Baryshnikova, G. Groeseneken, B. Kunert, M. Pantouvaki, J. Campenhout, and I. Wolf. IRPS, page 9. IEEE, (2022)Impact of Mechanical Stress on the Electrical Performance of 3D NAND.A. Kruv, A. Arreghini, M. Gonzalez, D. Verreck, G. den Bosch, I. Wolf, and A. Furnémont. IRPS, page 1-5. IEEE, (2019)Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.Y. Ding, O. Pedreira, M. Lofrano, H. Zahedmanesh, T. Chavez, H. Farr, I. Wolf, and K. Croes. IRPS, page 1-7. IEEE, (2023)Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors.S. Sangameswaran, J. Coster, G. Groeseneken, and I. Wolf. Microelectron. Reliab., 50 (9-11): 1383-1387 (2010)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.G. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact.F. Maggioni, H. Oprins, E. Beyne, I. Wolf, and M. Baelmans. Microelectron. J., 45 (12): 1746-1752 (2014)Electrical characterization and reliability study of integrated GaN power amplifier in multi-layer thin-film technology.R. Liu, D. Schreurs, W. Raedt, F. Vanaverbeke, J. Das, R. Mertens, and I. Wolf. Microelectron. Reliab., 51 (9-11): 1721-1724 (2011)

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Disambiguation of "Wolf, Ingrid De"

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Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.

Please choose a person to relate this publication to

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Wolf, Ingrid De"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.

Please choose a person to relate this publication to

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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MSOffice XML

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.