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Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging.

, , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 40 (4): 694-707 (2021)

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H2-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs., , , , , and . I. J. Circuit Theory and Applications, 43 (12): 1953-1970 (2015)Localized Statistical 3D Thermal Analysis Considering Electro-Thermal Coupling., , and . ISCAS, page 1289-1292. IEEE, (2009)An efficient algorithm for transient and distortion analysis of mildly nonlinear analog circuits., and . ISCAS (5), page 129-132. IEEE, (2004)DEEPEYE: A Compact and Accurate Video Comprehension at Terminal Devices Compressed with Quantization and Tensorization., , , , and . CoRR, (2018)Fast Power/Ground Network Optimization Based on Equivalent Circuit Modeling., and . DAC, page 550-554. ACM, (2001)Hierarchical approach to exact symbolic analysis of large analog circuits., , and . DAC, page 860-863. ACM, (2004)Hierarchical approach to exact symbolic analysis of large analog circuits., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 24 (8): 1241-1250 (2005)Compact representation and efficient generation of s-expandedsymbolic network functions for computer-aided analog circuit design., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 20 (7): 813-827 (2001)Prediction of chaotic time series by using ANNs, ANFIS and SVMs., , and . MOCAST, page 1-4. IEEE, (2018)Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip., , and . IPSJ Trans. Syst. LSI Des. Methodol., (2020)