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3D Ring Oscillator Based Test Structures to Detect a Trojan Die in a 3D Die Stack in the Presence of Process Variations.

, , , , , and . IEEE Trans. Emerg. Top. Comput., 9 (2): 774-786 (2021)

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A Production IR-Drop Screen on a Chip., , , and . IEEE Des. Test Comput., 24 (3): 216-224 (2007)Test Development for a Third-Version ColdFire Microprocessor., , , , and . IEEE Des. Test Comput., 17 (4): 29-37 (2000)Innovate Practices on CyberSecurity of Hardware Semiconductor Devices., , , , , , , , , and 4 other author(s). VTS, page 1. IEEE, (2019)Low-Power Mode and IEEE 1149.1 Compliance - A Low-Power Solution., , and . ITC, page 660-669. IEEE Computer Society, (1994)The testability features of the 3rd generation ColdFire family of microprocessors., , , , and . ITC, page 913-922. IEEE Computer Society, (1999)Separating temperature effects from ring-oscillator readings to measure true IR-drop on a chip., , , , , and . ITC, page 1-10. IEEE Computer Society, (2007)Future Trends in Test: The Adoption and Use of Low Cost Structural Testers.. ITC, page 698-703. IEEE Computer Society, (2004)Test Development for Second-Generation ColdFire Microprocessors., , , , and . IEEE Des. Test Comput., 15 (3): 70-76 (1998)BA-BIST: Board test from inside the IC out., and . ITC, page 1. IEEE Computer Society, (2013)Board assisted-BIST: Long and short term solutions for testpoint erosion - Reaching into the DFx toolbox., , , , , and . ITC, page 1-10. IEEE Computer Society, (2012)