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Routability in 3D IC design: Monolithic 3D vs. Skybridge 3D CMOS., , , , и . NANOARCH, стр. 145-150. ACM, (2016)SkyNet: Memristor-based 3D IC for artificial neural networks., , , , и . NANOARCH, стр. 109-114. IEEE, (2017)Embedded processors based on Spin Wave Functions (SPWFs)., , , , и . NANOARCH, стр. 32-33. IEEE Computer Society, (2013)Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology., , , , , и . ISVLSI, стр. 403-408. IEEE Computer Society, (2016)Fine-grained 3-D integrated circuit fabric using vertical nanowires., , , , и . 3DIC, стр. TS9.3.1-TS9.3.7. IEEE, (2015)Optimal Multi-access Computation Offloading for Mobile Blockchain., , , , , и . ICCS, стр. 198-203. IEEE, (2018)Architecting 3-D integrated circuit fabric with intrinsic thermal management features., , , , и . NANOARCH, стр. 157-162. IEEE Computer Society, (2015)Power-delivery network in 3D ICs: Monolithic 3D vs. Skybridge 3D CMOS., , и . NANOARCH, стр. 73-78. IEEE, (2017)Manufacturing Pathway and Experimental Demonstration for Nanoscale Fine-Grained 3-D Integrated Circuit Fabric., , , , и . CoRR, (2015)Towards automatic thermal network extraction in 3D ICs., , , , , и . NANOARCH, стр. 25-30. ACM, (2016)