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Fine-grained 3-D integrated circuit fabric using vertical nanowires.

, , , , and . 3DIC, page TS9.3.1-TS9.3.7. IEEE, (2015)

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Routability in 3D IC design: Monolithic 3D vs. Skybridge 3D CMOS., , , , and . NANOARCH, page 145-150. ACM, (2016)SkyNet: Memristor-based 3D IC for artificial neural networks., , , , and . NANOARCH, page 109-114. IEEE, (2017)Embedded processors based on Spin Wave Functions (SPWFs)., , , , and . NANOARCH, page 32-33. IEEE Computer Society, (2013)Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology., , , , , and . ISVLSI, page 403-408. IEEE Computer Society, (2016)Fine-grained 3-D integrated circuit fabric using vertical nanowires., , , , and . 3DIC, page TS9.3.1-TS9.3.7. IEEE, (2015)Optimal Multi-access Computation Offloading for Mobile Blockchain., , , , , and . ICCS, page 198-203. IEEE, (2018)Architecting 3-D integrated circuit fabric with intrinsic thermal management features., , , , and . NANOARCH, page 157-162. IEEE Computer Society, (2015)Power-delivery network in 3D ICs: Monolithic 3D vs. Skybridge 3D CMOS., , and . NANOARCH, page 73-78. IEEE, (2017)On the Design of Ultra-High Density 14nm Finfet Based Transistor-Level Monolithic 3D ICs., , , , and . ISVLSI, page 449-454. IEEE Computer Society, (2016)Joint Time and Power Allocations for Uplink Nonorthogonal Multiple Access Networks., , , , , , , and . MLICOM, volume 251 of Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, page 490-499. Springer, (2018)