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Disambiguation of "Singh, Shiv Govind"

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Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration.

, , , , and . 3DIC, page 1-4. IEEE, (2016)

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Shiv Kishor Singh

Shiv Srivastava

Shiv Prashad

Kirumakki Narayana Shivaram

Govind Ganatra

 

Other publications of authors with the same name

TSV noise coupling in 3D IC using guard ring., , , and . 3DIC, page TS8.35.1-TS8.35.5. IEEE, (2015)Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC., , , , and . 3DIC, page 1-4. IEEE, (2016)A 2μW biomedical frontend with ΣΔ ADC for self-powered U-healthcare devices in 0.18μm CMOS technology., , , , , , and . NEWCAS, page 1-4. IEEE, (2015)A 1.2V wide-band reconfigurable mixer for wireless application in 65nm CMOS technology., , , and . SoCC, page 49-52. IEEE, (2015)Low power reconfigurable multi-mode LNA utilizing subthreshold bias and low-Q inductors., , and . ISCAS, page 650-653. IEEE, (2015)Benchmarking of Multi-Bridge-Channel FETs Toward Analog and Mixed-Mode Circuit Applications., , , , , and . IEEE Access, (2024)A -34dBm sensitivity battery-less wake-up receiver with digital decoder., , , and . APCCAS, page 721-724. IEEE, (2016)Modeling and Fabrication Aspects of PVDF as a Membrane Material for Air Borne PMUT Applications., , , and . IEEE SENSORS, page 1-4. IEEE, (2018)Selective Anisotropic Dry Etching of Piezoelectric Silk Microstructures Using Oxygen Plasma Ashing., , , and . IEEE SENSORS, page 1-4. IEEE, (2018)A low-cost multi-phase 3A buck converter with improved ripple cancellation for wide supply range., , , and . ISCAS, page 1618-1621. IEEE, (2016)