( en | de | ru )

 

Disambiguation of "Franzon, Paul D."

Author of the publication

copydeleteadd this publication to your clipboard
Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications.

, , and . 3DIC, page 1-4. IEEE, (2010)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

D Zeppenfeld

D Zumkeller

D Bruß

D Breunig

D Riethmacher

 

Other publications of authors with the same name

Performance Driven Global Routing and Wiring Rule Generation for High Speed PCBs and MCMs., , and . DAC, page 381-387. ACM Press, (1995)Tools to Aid in Wiring Rule Generation for High Speed Interconnects., , , , , and . DAC, page 466-471. IEEE Computer Society Press, (1992)Low power interconnect design for fpgas with bidirectional wiring using nanocrystal floating gate devices (abstract only)., , , and . FPGA, page 277. ACM, (2011)Modeling and compare of through-silicon-via (TSV) in high frequency., , and . 3DIC, page 1-6. IEEE, (2011)Design automation for a 3DIC FFT processor for synthetic aperture radar: a case study., , and . DAC, page 51-56. ACM, (2009)Energy consumption modeling and optimization for SRAM's., and . IEEE J. Solid State Circuits, 30 (5): 571-579 (May 1995)Flexible Low Power Probability Density Estimation Unit For Speech Recognition., , and . ISCAS, page 1117-1120. IEEE, (2007)Will Nanotechnology Change the Way We Design and Verify Systems? (Panel)., , , , , , and . ICCAD, page 174. IEEE Computer Society, (2001)Exploring the Tradeoffs of Application-Specific Processing., and . IEEE J. Emerg. Sel. Topics Circuits Syst., 8 (3): 531-542 (2018)Molecular electronics: from devices and interconnect to circuits and architecture., , , , and . Proc. IEEE, 91 (11): 1940-1957 (2003)