( en | de | ru )

 

Disambiguation of "Xie, Yuan"

Author of the publication

copydeleteadd this publication to your clipboard
A Synthesis Algorithm for Reconfigurable Single-Electron Transistor Arrays.

, , , , , and . JETC, 9 (1): 5:1-5:20 (2013)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Jian Xie

Yangpei Xie

Mingliang Xie

Qian Xie

Zhenwei Xie

 

Other publications of authors with the same name

Power and performance of read-write aware Hybrid Caches with non-volatile memories., , , , and . DATE, page 737-742. IEEE, (2009)Toward Increasing FPGA Lifetime., , , , , , and . IEEE Trans. Dependable Secur. Comput., 5 (2): 115-127 (2008)Editorial- three-dimensional integrated circuits design., and . IET Comput. Digit. Tech., 5 (3): 159 (2011)Multi-objective Optimization of Fuzzy Parallel Machines Scheduling Problem Using Nondominated Genetic Algorithms.. J. Softw., 6 (10): 2036-2042 (2011)Guest Editorial., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 32 (4): 485-486 (2013)Parana: A Parallel Neural Architecture Considering Thermal Problem of 3D Stacked Memory., , , , , , , , , and 1 other author(s). IEEE Trans. Parallel Distributed Syst., 30 (1): 146-160 (2019)K-Hyperline Clustering-Based Color Image Segmentation Robust to Illumination Changes., , , , and . Symmetry, 10 (11): 610 (2018)Taming Unstructured Sparsity on GPUs via Latency-Aware Optimization., and . DAC, page 1-6. IEEE, (2020)Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs., , , , , and . 3DIC, page 1-5. IEEE, (2009)Arithmetic unit design using 180nm TSV-based 3D stacking technology., , , , , , and . 3DIC, page 1-4. IEEE, (2009)