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Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication.

, , , and . ESSCIRC, page 546-549. IEEE, (2022)

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A Multi-Port Dual Polarized Antenna Coupled mm-Wave CMOS Receiver with Element-level Pattern and Notch Programmability and Passive Interferer Rejection Capability., , , and . CICC, page 1-4. IEEE, (2019)Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication., , , and . ESSCIRC, page 546-549. IEEE, (2022)Terahertz Chip-scale Systems., , , , and . ECOC, page 1-3. IEEE, (2020)2D Magnetic Sensor Array for Real-time Cell Tracking and Multi-site Detection with Increased Robustness and Flow-rate., , , , , , , , , and . CICC, page 1-4. IEEE, (2019)29.9 A 4×4 Distributed Multi-Layer Oscillator Network for Harmonic Injection and THz Beamforming with 14dBm EIRP at 416GHz in a Lensless 65nm CMOS IC., , , , , and . ISSCC, page 256-258. IEEE, (2020)22.1 THz Prism: One-Shot Simultaneous Multi-Node Angular Localization Using Spectrum-to-Space Mapping with 360-to-400GHz Broadband Transceiver and Dual-Port Integrated Leaky-Wave Antennas., , , and . ISSCC, page 314-316. IEEE, (2021)Wavefront Manipulation Attack via Programmable mmWave Metasurfaces: from Theory to Experiments., , , , and . WISEC, page 317-328. ACM, (2023)A 4 × 4 Steerable 14-dBm EIRP Array on CMOS at 0.41 THz With a 2-D Distributed Oscillator Network., , , , , and . IEEE J. Solid State Circuits, 57 (10): 3125-3138 (2022)