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29.8 THzID: A 1.6mm2 Package-Less Cryptographic Identification Tag with Backscattering and Beam-Steering at 260GHz.

, , , , , , and . ISSCC, page 454-456. IEEE, (2020)

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Physical-Layer Security for THz Communications via Orbital Angular Momentum Waves., , , , , and . SiPS, page 1-6. IEEE, (2022)29.8 THzID: A 1.6mm2 Package-Less Cryptographic Identification Tag with Backscattering and Beam-Steering at 260GHz., , , , , , and . ISSCC, page 454-456. IEEE, (2020)A 0.31-THz Orbital-Angular-Momentum (OAM) Wave Transceiver in CMOS With Bits-to-OAM Mode Mapping., , , , , , and . IEEE J. Solid State Circuits, 57 (5): 1344-1357 (2022)Emerging Terahertz Integrated Systems in Silicon., , , , , , , , , and 3 other author(s). IEEE Trans. Circuits Syst. I Regul. Pap., 68 (9): 3537-3550 (2021)A Scalable Quantum Magnetometer in 65nm CMOS with Vector-Field Detection Capability., , , and . ISSCC, page 458-461. IEEE, (2019)Room-Temperature Quantum Sensing in CMOS: On-Chip Detection of Electronic Spin States in Diamond Color Centers for Magnetometry., , , , and . VLSI Circuits, page 249-250. IEEE, (2018)High-Scalability CMOS Quantum Magnetometer With Spin-State Excitation and Detection of Diamond Color Centers., , , and . IEEE J. Solid State Circuits, 56 (3): 1001-1014 (2021)CMOS THz-ID: A 1.6-mm² Package-Less Identification Tag Using Asymmetric Cryptography and 260-GHz Far-Field Backscatter Communication., , , , , , and . IEEE J. Solid State Circuits, 56 (2): 340-354 (2021)Miniaturized Chip-Scale Quantum and Terahertz Systems Through Tight Integration of Electronics, Electromagnetics, and Qubits.. Massachusetts Institute of Technology, USA, (2021)THz Cryo-CMOS Backscatter Transceiver: A Contactless 4 Kelvin-300 Kelvin Data Interface., , , , , , , and . ISSCC, page 504-505. IEEE, (2023)