Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads., , , and . Microelectron. Reliab., 53 (9-11): 1575-1580 (2013)Dynamic void formation in a DD-copper-structure with different metallization geometry., , , and . Microelectron. Reliab., 47 (2-3): 319-325 (2007)SRAM Test Chip for Radiation Experiment, , , , , and . Pan Pacific Symposium 2022, (2022)Dynamical IMC-growth calculation., , and . Microelectron. Reliab., 55 (9-10): 1832-1837 (2015)Simulation of the influence of TiAl3 layers on the thermal-electrical and mechanical behaviour of Al metallizations., , , and . Microelectron. Reliab., 52 (9-10): 1987-1992 (2012)Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology, , , , , , and . Applied Reconfigurable Computing. Architectures, Tools, and Applications, page 357--360. Cham, Springer Nature Switzerland, (2023)Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys., , , , , , , and . Microelectron. Reliab., 55 (9-10): 1882-1885 (2015)A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure, , , , , and . 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), page 1-5. (April 2023)Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core., , , , and . Microelectron. Reliab., 54 (6-7): 1206-1211 (2014)A design for robust wide metal tracks., , , and . Microelectron. Reliab., 52 (9-10): 2447-2451 (2012)