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Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs.

Y. Chen, E. Kursun, D. Motschman, C. Johnson, and Y. Xie. ISLPED, page 397-402. IEEE/ACM, (2011)

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Sükrü Kursun

Attila Eren

Eren Başar

Mert Eren

Mustafa Eren

Other publications of authors with the same name

Early evaluation techniques for low power binding.E. Kursun, A. Srivastava, S. Memik, and M. Sarrafzadeh. ISLPED, page 160-165. ACM, (2002)Hotspot monitoring and Temperature Estimation with miniature on-chip temperature sensors.P. Chundi, Y. Zhou, M. Kim, E. Kursun, and M. Seok. ISLPED, page 1-6. IEEE, (2017)Power-efficient, reliable microprocessor architectures: modeling and design methods.P. Bose, A. Buyuktosunoglu, C. Cher, J. Darringer, M. Gupta, H. Hamann, H. Jacobson, P. Kudva, E. Kursun, N. Madan and 5 other author(s). ACM Great Lakes Symposium on VLSI, page 299-304. ACM, (2010)Energy-Aware Accounting and Billing in Large-Scale Computing Facilities.V. Jiménez, F. Cazorla, R. Gioiosa, E. Kursun, C. Isci, A. Buyuktosunoglu, P. Bose, and M. Valero. IEEE Micro, 31 (3): 60-71 (2011)Thermomechanical stress-aware management for 3D IC designs.Q. Zou, T. Zhang, E. Kursun, and Y. Xie. DATE, page 1255-1258. EDA Consortium San Jose, CA, USA / ACM DL, (2013)Design, CAD and technology challenges for future processors: 3D perspectives.J. Burns, G. Carpenter, E. Kursun, R. Puri, J. Warnock, and M. Scheuermann. DAC, page 212. ACM, (2011)Trends and techniques for energy efficient architectures.V. Jiménez, R. Gioiosa, E. Kursun, F. Cazorla, C. Cher, A. Buyuktosunoglu, P. Bose, and M. Valero. VLSI-SoC, page 276-279. IEEE, (2010)Transistor Level Budgeting for Power Optimization.E. Kursun, S. Ghiasi, and M. Sarrafzadeh. ISQED, page 116-121. IEEE Computer Society, (2004)Variation-aware thermal characterization and management of multi-core architectures.E. Kursun, and C. Cher. ICCD, page 280-285. IEEE Computer Society, (2008)3D stacking of high-performance processors.P. Emma, A. Buyuktosunoglu, M. Healy, K. Kailas, V. Puente, R. Yu, A. Hartstein, P. Bose, J. Moreno, and E. Kursun. HPCA, page 500-511. IEEE Computer Society, (2014)

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Disambiguation of "Kursun, Eren"

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Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs.

Please choose a person to relate this publication to

Sükrü Kursun

Attila Eren

Eren Başar

Mert Eren

Mustafa Eren

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Kursun, Eren"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs.

Please choose a person to relate this publication to

Sükrü Kursun

Attila Eren

Eren Başar

Mert Eren

Mustafa Eren

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs.