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Disambiguation of "Lee, Ki-Don"

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Impact of Barrier Metal Thickness on SRAM Reliability.

, , , , , , , , , , , and . IRPS, page 1-6. IEEE, (2023)

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Ki-Don Hwang

Don-Ho Lee

Don-Ho Lee

Ki-Chan Lee

Dong-Ki Lee

 

Other publications of authors with the same name

Trap Density Modulation for IO FinFET NBTI Improvement., , , , , , , , , and 5 other author(s). IRPS, page 1-5. IEEE, (2020)Polarity Dependency of MOL-TDDB in FinFET., , , , , , , , , and 2 other author(s). IRPS, page 1-3. IEEE, (2023)A Systematic Study of HCI Improvement in FinFET with Source/Drain Implant and Geometry Modulation., , , , , , , , , and 6 other author(s). IRPS, page 5. IEEE, (2024)Impacts of Post-Cu CMP Queue Time on Reliability., , , , , , , , , and 4 other author(s). IRPS, page 1-5. IEEE, (2024)Electromigration reliability issues in dual-damascene Cu interconnections., , , and . IEEE Trans. Reliability, 51 (4): 403-419 (2002)Reverse Body Bias Dependence of HCI Reliability in Advanced FinFET., , , , , , and . IRPS, page 58-1. IEEE, (2022)Impact of Barrier Metal Thickness on SRAM Reliability., , , , , , , , , and 2 other author(s). IRPS, page 1-6. IEEE, (2023)Systematic Study of Process Impact on FinFET Reliability., , , , , , , , , and 5 other author(s). IRPS, page 1-5. IEEE, (2021)Polarity Dependence and Metal Density Impact on Multi-Layer Inter-Level TDDB for High Voltage Application., , , , , , , and . IRPS, page 1-4. IEEE, (2022)