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Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC.

, , , , , , , , , , , , and . IRPS, page 3. IEEE, (2015)

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Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study., , , and . DATE, page 885-888. IEEE, (2018)An optimal operating point by using error monitoring circuits with an error-resilient technique., , , and . VLSI-SoC, page 69-73. IEEE, (2015)GRASP based metaheuristics for layout pattern classification., , and . ICCAD, page 512-518. IEEE, (2017)Multimodal interfaces and communication cues for remote collaboration., , and . J. Multimodal User Interfaces, 14 (4): 313-319 (2020)Sharing hand gesture and sketch cues in remote collaboration., , , and . J. Vis. Commun. Image Represent., (2019)The RayHand Navigation: A Virtual Navigation Method with Relative Position between Hand and Gaze-Ray., , , , , and . CHI, page 634:1-634:15. ACM, (2024)A User Study on MR Remote Collaboration Using Live 360 Video., , , and . ISMAR, page 153-164. IEEE, (2018)HandsInTouch: sharing gestures in remote collaboration., , , and . OZCHI, page 396-400. ACM, (2018)Incorporating second-order information into two-step major phrase break prediction for Korean., , , and . INTERSPEECH, ISCA, (2006)Machine Learning Framework for Early Routability Prediction with Artificial Netlist Generator., , , , , and . DATE, page 1809-1814. IEEE, (2021)