Author of the publication

"Cool low power" 1GHz multi-port register file and dynamic latch in 1.8 V, 0.25 mum SOI and bulk technology (poster session).

, , , and . ISLPED, page 203-206. ACM, (2000)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

3-D-TCAD-Based Parasitic Capacitance Extraction for Emerging Multigate Devices and Circuits., , and . IEEE Trans. Very Large Scale Integr. Syst., 21 (11): 2094-2105 (2013)Influence and model of gate oxide breakdown on CMOS inverters., , , , and . Microelectron. Reliab., 43 (9-11): 1439-1444 (2003)Overview of Circuits, Systems, and Applications of Spintronics., , , , , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 6 (3): 265-278 (2016)New optimal design strategies and analysis of ultra-low leakage circuits for nano-scale SOI technology., , , , and . ISLPED, page 168-171. ACM, (2003)Hierarchical Memory System With STT-MRAM and SRAM to Support Transfer and Real-Time Reinforcement Learning in Autonomous Drones., , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 9 (3): 485-497 (2019)SRAM methodology for yield and power efficiency: per-element selectable supplies and memory reconfiguration schemes., , , , , , , and . ISLPED, page 87-92. ACM, (2008)Editorial TVLSI Positioning - Continuing and Accelerating an Upward Trajectory., , , , , , , , , and 47 other author(s). IEEE Trans. Very Large Scale Integr. Syst., 27 (2): 253-280 (2019)The resilience wall: Cross-layer solution strategies., , , , , , , , , and 3 other author(s). VLSI-DAT, page 1-11. IEEE, (2014)Guest Editorial Emerging Memories - Technology, Architecture and Applications (Second Issue)., , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 6 (3): 261-264 (2016)A novel sample reuse methodology for fast statistical simulations with applications to manufacturing variability., and . ISQED, page 672-678. IEEE, (2012)