Author of the publication

Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering.

, , , , , and . Microelectron. Reliab., 48 (3): 389-394 (2008)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding., , , and . Microelectron. Reliab., 51 (1): 125-129 (2011)Geometric design for ultra-long needle probe card for digital light processing wafer testing., , , and . Microelectron. Reliab., 50 (4): 556-563 (2010)Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages., and . Microelectron. Reliab., 47 (1): 104-110 (2007)Warpage evolution of overmolded ball grid array package during post-mold curing thermal process., , and . Microelectron. Reliab., 51 (12): 2263-2273 (2011)Support excitation scheme for transient analysis of JEDEC board-level drop test., and . Microelectron. Reliab., 46 (2-4): 626-636 (2006)Evaluation of board-level reliability of electronic packages under consecutive drops., , and . Microelectron. Reliab., 46 (7): 1172-1182 (2006)Fine pitch copper wire bonding in high volume production., , , and . Microelectron. Reliab., 51 (1): 13-20 (2011)Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition., , and . Microelectron. Reliab., 46 (2-4): 645-650 (2006)Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile., , , and . Microelectron. Reliab., 53 (2): 297-302 (2013)Structural design optimization for board-level drop reliability of wafer-level chip-scale packages., , , and . Microelectron. Reliab., 48 (5): 757-762 (2008)