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Corrosion protection of anisotropically conductive adhesive joined flip chips., , and . Microelectron. Reliab., 50 (8): 1152-1158 (2010)Effects of different test profiles of temperature cycling tests on the reliability of RFID tags., , and . Microelectron. Reliab., 55 (1): 93-100 (2015)Reliability of adhesive joined thinned chips on flexible substrates under humid conditions., and . Microelectron. Reliab., 54 (9-10): 2058-2063 (2014)Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates., , and . Microelectron. Reliab., (2016)Development of a matrix test board for capacitor reliability testing., , and . Microelectron. Reliab., 50 (9-11): 1711-1714 (2010)Flip chip attachment on flexible LCP substrate using an ACF., and . Microelectron. Reliab., 45 (3-4): 583-588 (2005)Fretting corrosion: Analysis of the failure mechanism for low voltage drives applications., , , and . Microelectron. Reliab., 54 (9-10): 2109-2114 (2014)Chip on flex attachment with thermoplastic ACF for RFID applications., , and . Microelectron. Reliab., 42 (9-11): 1559-1562 (2002)Protective coatings of electronics under harsh thermal shock., , and . Microelectron. Reliab., 54 (9-10): 2048-2052 (2014)High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates., , and . Microelectron. Reliab., 54 (9-10): 2017-2022 (2014)