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Future system and memory architectures: Transformations by technology and applications.

, , and . ISSCC, page 530. IEEE, (2011)

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Future system and memory architectures: Transformations by technology and applications., , and . ISSCC, page 530. IEEE, (2011)Introduction to the Special Section on the 2007 Asian Solid-State Circuits Conference (A-SSCC'07)., and . IEEE J. Solid State Circuits, 43 (11): 2352-2353 (2008)E1 Ultimate Limits of Integrated Electronics., , , and . ISSCC, page 146-147. IEEE, (2007)Private Equity: Fight them or Invite them., and . ISSCC, page 156-157. IEEE, (2008)A 4.8GB/s 256Mb(x16) Reduced-Pin-Count DRAM and Controller Architecture (RPCA) to Reduce Form-Factor & Cost for IOT/Wearable/TCON/Video/AI-Edge Systems., , , , , , , , , and 5 other author(s). VLSI Circuits, page 116-. IEEE, (2019)Enhanced Core Circuits for scaling DRAM: 0.7V VCC with Long Retention 138ms at 125°C and Random Row/Column Access Times Accelerated by 1.5ns., , , , , , , , and . VLSI Circuits, page 1-2. IEEE, (2021)Optimizing Monolithic and Heterogeneous Integration to Create Intelligent-Grand-Scale-Integration for Smart MicroSystems.. DRC, page 1-2. IEEE, (2021)A computer designed half Gb 16-channel 819Gb/s high-bandwidth and 10ns low-latency DRAM for 3D stacked memory devices using TSVs., , , , , , , , , and 11 other author(s). VLSIC, page 186-. IEEE, (2015)