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Integrated flow for reverse engineering of nanoscale technologies., , , , , , , , , and . ASP-DAC, page 82-89. ACM, (2019)ESD Susceptibility of Submicron Air Gaps., , , and . Microelectron. Reliab., 46 (9-11): 1587-1590 (2006)Capacitively coupled transmission line pulsing cc-TLP--a traceable and reproducible stress method in the CDM-domain., , , and . Microelectron. Reliab., 45 (2): 279-285 (2005)Transient latch-up: experimental analysis and device simulation., , , , , , , and . Microelectron. Reliab., 45 (2): 297-304 (2005)On-chip electrostatic discharge ESD.. Microelectron. Reliab., 43 (7): 985-986 (2003)Transient-induced latch-up test setup for wafer-level and package-level., , , , , and . Microelectron. Reliab., 46 (9-11): 1629-1633 (2006)Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP., , and . Microelectron. Reliab., 49 (12): 1476-1481 (2009)Electrostatic discharge sensitivity investigation on organic field-effect thin film transistors., , , and . NEWCAS, page 1-4. IEEE, (2015)Physical and Functional Reverse Engineering Challenges for Advanced Semiconductor Solutions., , , , , , , , , and 1 other author(s). DATE, page 796-801. IEEE, (2022)Study of CDM specific effects for a smart power input protection structure., , , , , , , , , and . Microelectron. Reliab., 46 (5-6): 666-676 (2006)