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Brain-Inspired Hyperdimensional Computing: How Thermal-Friendly for Edge Computing?, , и . IEEE Embed. Syst. Lett., 15 (1): 29-32 (марта 2023)Power Side-Channel Attacks in Negative Capacitance Transistor., , , , , , , и . IEEE Micro, 40 (6): 74-84 (2020)On-Demand Mobile CPU Cooling With Thin-Film Thermoelectric Array., , , и . IEEE Micro, 41 (4): 67-73 (2021)Minimizing Excess Timing Guard Banding Under Transistor Self-Heating Through Biasing at Zero-Temperature Coefficient., , , , и . IEEE Access, (2021)FN-CACTI: Advanced CACTI for FinFET and NC-FinFET Technologies., , , , , и . IEEE Trans. Very Large Scale Integr. Syst., 30 (3): 339-352 (2022)Automated Design Approximation to Overcome Circuit Aging., , , , и . IEEE Trans. Circuits Syst. I Regul. Pap., 68 (11): 4710-4721 (2021)Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging., , , , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 40 (4): 694-707 (2021)Golden-Free Robust Age Estimation to Triage Recycled ICs., , , , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (9): 2839-2851 (сентября 2023)Stress-Resiliency of AI Implementations on FPGAs., , , , и . FPL, стр. 333-338. IEEE, (2023)Brain-Inspired Computing: Adventure from Beyond CMOS Technologies to Beyond von Neumann Architectures ICCAD Special Session Paper., , , , , , , , , и . ICCAD, стр. 1-9. IEEE, (2021)