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Sensitivity improvement in FSI CIS using the M1ToP™ smart process technique., , , , , , , , , and 2 other author(s). ISOCC, page 317-319. IEEE, (2012)A 1.2-Mpixel Indirect Time-of-Flight Image Sensor With 4-Tap 3.5-μm Pixels for Peak Current Mitigation and Multi-User Interference Cancellation., , , , , , , , , and 10 other author(s). IEEE J. Solid State Circuits, 56 (11): 3209-3219 (2021)A 4-tap 3.5 μm 1.2 Mpixel Indirect Time-of-Flight CMOS Image Sensor with Peak Current Mitigation and Multi-User Interference Cancellation., , , , , , , , , and 12 other author(s). ISSCC, page 106-108. IEEE, (2021)Automotive 2.1 μm Full-Depth Deep Trench Isolation CMOS Image Sensor with a 120 dB Single-Exposure Dynamic Range., , , , , , , , , and 17 other author(s). Sensors, 23 (22): 9150 (November 2023)A 1/2.8-inch 24Mpixel CMOS image sensor with 0.9μm unit pixels separated by full-depth deep-trench isolation., , , , , , , , , and 10 other author(s). ISSCC, page 84-86. IEEE, (2018)An Indirect Time-of-Flight CMOS Image Sensor Achieving Sub-ms Motion Lagging and 60fps Depth Image from On-chip ISP., , , , , , , , , and 10 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)A 1/1.33-inch 108Mpixel CMOS Image Sensor with 0.8um unit NONACELL pixels., , , , , , , and . ISCAS, page 288-291. IEEE, (2022)5.6 A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7µm Pixels Fabricated in Advanced Full-Depth Deep-Trench Isolation Technology., , , , , , , , , and 12 other author(s). ISSCC, page 104-106. IEEE, (2020)7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate., , , , , , , , , and 29 other author(s). ISSCC, page 124-125. IEEE, (2014)