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Bias temperature instability in scaled CMOS technologies: A circuit perspective., and . Microelectron. Reliab., (2018)Optimized LDMOS Offering for Power Management and RF Applications., , , , , , , , , and 5 other author(s). IRPS, page 57-1. IEEE, (2022)Cost-effective cleaning and high-quality thin gate oxides., , , , , , , , , and 8 other author(s). IBM J. Res. Dev., 43 (3): 339-350 (1999)A Novel HCI Reliability Model for RF/mmWave Applications in FDSOI Technology., , , , , , , and . IRPS, page 1-5. IEEE, (2020)HTOL SRAM Vmin shift considerations in scaled HKMG technologies., , , , , , , , , and 2 other author(s). CICC, page 1-4. IEEE, (2014)Robust Off-State TDDB Reliability of n-LDMOS., , , , and . IRPS, page 26-1. IEEE, (2022)Assessing intrinsic and extrinsic end-of-life risk using functional SRAM wafer level testing., , , , , , , , , and 3 other author(s). IRPS, page 6. IEEE, (2015)Understanding gate metal work function (mWF) impact on device reliability - A holistic approach., , , , , , , , and . IRPS, page 6. IEEE, (2018)Impact of Transistor Level degradation on product reliability.. CICC, page 431-438. IEEE, (2009)Off-state TDDB in FinFET Technology and its Implication for Safe Operating Area., , , , , , , and . IRPS, page 1-6. IEEE, (2021)